Job Descriptions
- Provide process support for Electroplating processes.
- Responsible for trial run of new products, new machines, new materials and etc.
- Implement actions to improve yield, quality, productivity and process stability.
- Work closely with maintenance and equipment engineering to trouble shoot issues, develop maintenance plans, recommend tooling upgrades etc.
- Assist Production team in trouble shooting of the lines.
- To investigate the quality problem and generate effective 8D reports.
- To create and update documented procedure / work instruction for the relevant processes.
- To manage plating line including tank chemistry, plating processing, chemical analysis, and process control
- Manage plating chemical and material consumption effectively with respective counterparts based on production forecast and engineering projects.
- Able to train plating employees on new and existing processes.
- To develop and to industrialize Cu plating process with vertical and horizontal equipment for new packages, introduce materials to meet the quality, yield, and mission of new application.
- To generate and update process specifications, SOP, FMEA and process control plan.
- Candidate must possess at least Bachelor’s or Associates Degree in Chemistry/Metallurgy/Plating Technology. Bachelor's Degree in Engineering (Material Science), Engineering (Chemical), Engineering (Mechanical), Engineering (Electrical / Electronic), Physics, Chemistry or equivalent.
- More than 3 years working experience.
- Preferably Engineer specialized in Electroplating / Production Operations or equivalent.
- Possess high Semiconductors Process Development Engineering skills on Wafer Level Packaging and Back End Operations.
- Systematic Problem-Solving methodology e.g., 8D, DMAIC, Process Mapping, Fish Bond
- Be comfortable to work in a chemical environment.