Our client, a global leader in the design and manufacture of semiconductor assembly equipment is now seeking talented individuals with an innovative mindset to join their team.
Job Descriptions
- Responsible mainly on ball-bonder activities at customer site
- Provide technical support and product training to customer
- Provide feedback to factory on customer reported issues for solutions
- Support factory on any on site retrofit if needed
- Support BU on any news consumable tool evaluation and quality at customer site
Job Requirements
- At least 7 years of experience in Semiconductor environment
- Able to communicate effectively in English - both written and oral
- Capable to handle and interact well with customers
- Able to work independently and willing to accept working beyond normal hours when needed
- Possess service/field support experience
- Must experience in Advance Solution (TCX3 & Aptura) machine, die bond (TCB or Flip Chip)
If this opportunity sounds of interest to you, please send your resume to the Quick Apply button at the bottom of this page.