An established MNC in wafer packaging industry, seeking talented individuals with an innovative mindset to join their Engineering team. You will be a key part of revolutionary in the advanced packaging equipment for automated and high precision manufacturing industries.
JOB DESCRIPTIONS
- Perform troubleshooting, installation, process evaluation, setup, maintenance/preventive maintenance, field modifications, and repair on designated equipment,
- Order and manage repair part cycle time.
- Maintain customer service log and internal service records in a timely manner.
- Maintain daily communication with customers to ensure issue resolution and proper follow up.
- Maintain tools and test equipment to ensure proper calibration.
- Adhere to requirements such as HIPPA, OSHA, FDA, etc
JOB REQUIREMENTS
- Min Bachelor’s Degree in related Engineering field.
- Min 3 years of working experience as process, field service, or application engineering in semiconductor industries.
- Experience in thin film deposition, SMT, Cu-RDL / Cu-Pillar, or WLP.
- Familiar with FMEA, Control Plan, SPC, WI, etc.
- Possess own transport.
- Willing and able to travel in short notice.
- Ability to lift and carry toolbox weighing up to 5lbs.