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Lead Engineer, Hardware Design (Thermal)

Job title: Lead Engineer, Hardware Design (Thermal)
Location: Pulau Pinang
Specialisation: Engineering & Manufacturing
Salary: MYR 84,000 - 120,000 (Annual)
Reference: PR/158004
Contact details: Kee Eng Chew
Contact email: keeeng.chew@jac-recruitment.com
Job published: September 30, 2024 10:36
Work Arrangement: Onsite

We are seeking talented and motivated Engineer to join our dynamic and growing organization that enable industry leaders to deliver products that leave positive impacts to the world.

 

Job Descriptions

  • Responsible for thermal test validation of IT equipment including server/storage/switch product.
  • Set-up thermal test environment and execute the thermal test including wind tunnel test and temperature test.
  • Work with other function team to resolve thermal relevant issues.
  • Document comprehensive thermal test plan and report.
Job Requirements
  • Degree in Thermal Engineering and equivalents.
  • Min 3 years’ experience in thermal design & test validation of electronic
    product
  • Server/storage/switch product experience is preferred.
  • Familiar with thermal measurement technology and tools such as temperature data logger, IR camera, wind-tunnel and etc
  • Familiar with fluid dynamic and heat transfer knowledge
  • Familiar with Thermal parts including Heat sink, TIM, air movers
  • Hands on experience on validation test of various fan speed control algorithm and over temperature protection mechanism
  • Good skills in thermal test data analysis and report
If this opportunity sounds of interest to you then please send your resume to the quick apply button at the bottom of this page.