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Lead Engineer, Hardware Design (Thermal)

役職名: Lead Engineer, Hardware Design (Thermal)
勤務地: Pulau Pinang
職種: エンジニアリング・製造
給与: MYR 84,000 - 120,000 (Annual)
求人番号: PR/158004
担当者: Kee Eng Chew
お問い合わせ先: keeeng.chew@jac-recruitment.com
求人情報掲載日: 2024/09/30 10:36
勤務形態: オフィス勤務

We are seeking talented and motivated Engineer to join our dynamic and growing organization that enable industry leaders to deliver products that leave positive impacts to the world.

 

Job Descriptions

  • Responsible for thermal test validation of IT equipment including server/storage/switch product.
  • Set-up thermal test environment and execute the thermal test including wind tunnel test and temperature test.
  • Work with other function team to resolve thermal relevant issues.
  • Document comprehensive thermal test plan and report.
Job Requirements
  • Degree in Thermal Engineering and equivalents.
  • Min 3 years’ experience in thermal design & test validation of electronic
    product
  • Server/storage/switch product experience is preferred.
  • Familiar with thermal measurement technology and tools such as temperature data logger, IR camera, wind-tunnel and etc
  • Familiar with fluid dynamic and heat transfer knowledge
  • Familiar with Thermal parts including Heat sink, TIM, air movers
  • Hands on experience on validation test of various fan speed control algorithm and over temperature protection mechanism
  • Good skills in thermal test data analysis and report
If this opportunity sounds of interest to you then please send your resume to the quick apply button at the bottom of this page.