An established MNC in wafer packaging industry, seeking talented individuals with an innovative mindset to join their Engineering team. You will be a key part of revolutionary in the advanced packaging equipment for automated and high precision manufacturing industries.
JOB DESCRIPTIONS
Developing, configuring and optimizing SMT processes from inception through to start up and certification.
Assessing processes, taking measurements, interpreting data and create engineering report.
Design, run, test and upgrade SMT systems and processes.
Provide training and leadership for a team of technicians and operators.
Define and generate relevant design rules, defect catalog and process documentation.
Develop best practices, routines and innovative solutions to improve production rates and quality of output.
Perform process simulations.
Manage cost and time constraints.
Perform risk assessments.
Provide process documentation and operating instructions.
JOB REQUIREMENT
At least a Bachelor's Degree in Engineering (Electrical/Electronic), Physics, Chemistry or equivalent.
Minimum of 5 years’ experience in the field of semiconductor and/ or electrical component.
Minimum of 3 years’ experience in SMT equipment development and/or SMT process development.
Stencil design experience is advantageous.
Knowledgeable in DOE, SPC, GR&R, FMEA and 8D methodologies.
Able to communicate with customer.
Analytical thinker with interpersonal skills and the ability to work independently.
Good communication skills in English & Malay (both verbal & written).
Applicants should be Malaysian citizens or hold relevant residence status.
If this opportunity sounds of interest to you then please send your resume to the quick apply button at the bottom of this page.